首页> 外文OA文献 >Improved interfacial and electrical properties of Ge MOS capacitor by using TaON/LaON dual passivation interlayer
【2h】

Improved interfacial and electrical properties of Ge MOS capacitor by using TaON/LaON dual passivation interlayer

机译:通过使用TaON / LaON双钝化夹层改善Ge MOS电容器的界面和电学性能

代理获取
本网站仅为用户提供外文OA文献查询和代理获取服务,本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文,但由于OA文献来源多样且变更频繁,仍可能出现获取不到、文献不完整或与标题不符等情况,如果获取不到我们将提供退款服务。请知悉。

摘要

The effects of TaON/LaON dual passivation interlayer on the interfacial and electrical properties of Ge metal-oxide-semiconductor (MOS) capacitor with HfO2 gate dielectric are investigated. As compared to its counterpart with only LaON as passivation interlayer, the formation of HfGeOx and LaHfOx, which would degrade the interfacial quality, is effectively suppressed due to the strong blocking role of the TaON barrier layer against Hf diffusion. As a result, excellent interfacial and electrical properties are achieved for the Ge MOS device with the TaON/LaON dual passivation interlayer: high k value (20.9), low interface-state density (5.32 × 1011cm-2eV-1) and oxide-charge density (-3.90 × 1012cm-2), low gate leakage current density (1.77 × 10-4 A/cm2 at Vg = Vfb + 1 V), and high reliability under high-field stress.
机译:研究了TaON / LaON双钝化中间层对具有HfO2栅介电层的Ge金属氧化物半导体(MOS)电容器的界面和电学性能的影响。与TaON阻挡层对Hf扩散的强阻挡作用相比,与仅用LaON作为钝化中间层的对应物相比,可以有效地抑制会降低界面质量的HfGeOx和LaHfOx的形成。结果,具有TaON / LaON双钝化中间层的Ge MOS器件获得了出色的界面和电学性能:高k值(20.9),低界面态密度(5.32×1011cm-2eV-1)和氧化物电荷密度(-3.90×1012cm-2),低栅极漏电流密度(在Vg = Vfb +1 V时为1.77×10-4 A / cm2)和高场应力下的高可靠性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
代理获取

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号